Engineer - Plating (SOW)

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Your Responsibilities

• Generate Equipment Specifications based on current and Future Product Requirements

• Close Communication with Supplier for meeting of Spec on Web requirement - machine manufacturing and after machine delivery to AT&S sites

• Source Inspection of New Equipment/Supplier/Process and Risk Assessment for Non POR/Improvement/Upgrade on Equipment at Supplier Side

• Documentation of all key learnings and best known method (BKM) from Source Inspection, Installation and qualification to ensure proliferation to other Equipment 

• Meeting Equipment Planned Timeline from Ordering, Delivery, Installation and Qualification

• Confirm all the Facilities, Utilities, and safety Requirements for the assigned Equipment and Ensure all standards are followed and prepared accordingly prior to Tool Arrival.

• Manage the Suppliers doing the Equipment Installation

• Responsible to lead and provide proper guidance to Technicians and Operators supporting the machine Installation and Qualification

• Preparation and Closure of all Standard Workflows related to Machine Move In, Hook Up and Installation until Qualification

• Integrate tool installation, setup and complete process qualification. Coordinate and lead on improvement projects such as Cost optimization, Capacity improvement, Green Belt Projects, Yield improvement, Taskforces and do collaboration with other department for the project assigned 

• Responsible to review and propose the improvement of Qualification Plan, Customer Qualification Application Documents, Qualification Execution and Data gathering

• Focus on any report of equipment status, work status and incidents, as well as problems and highlights to superior and management

Your Profile

• Bachelor’s Degree in Material Science, Mechanical, Electronic, Chemical Engineering or equivalent 

• Minimum 3 years’ working experience in manufacturing industry with knowledge of project management, data evaluation and design of experiment are preferable 

• Extensive Experience and Knowledge in the fields of IC-Substrate, Semiconductor, Printed Circuit board, IC-Packaging

• Expert in Copper Plating Processes/Equipment; Familiar with up-to-date overview of state of the art equipment in IC-substrate and researching of emerging innovative technologies in areas of Copper Plating process (such as fine line trace plating such as single digit micron meter)

• Knowledge of quality tools: SPC, MSA, DOE, FMEA, CP are an added advantage

• Strong problem solving skills, good analytical skills: QC 7 steps, 6 sigma, JMP, Minitab, PDCA, MBPS

• Able to work independently, minimum supervision, dedicated, results oriented, hardworking and able to work under pressure

• Able to Multitask, Fast Learner, Adaptable/Flexible to Changes in Job Scope 

• Willingness to travel and stay abroad for working in an enriching intercultural environment

• Good interpersonal and communication skills

Our Offer

• Personal and professional growth opportunities in a Greenfield Project of a recognized MNC
• A chance to actively contribute to AT&S´ success and to create value
• A secure position with long-term career perspective in an internationally expanding environment
• Attractive and competitive compensation package